To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.
To create photonic multi-chip modules, integrated photonic chips n ...
DETAILS
Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
Dissertationsschrift
Lindenmann, Nicole
Kartoniert, 256 S.
graph. Darst.
Sprache: Englisch
21 cm
ISBN-13: 978-3-7315-0746-8
Titelnr.: 68363781
Gewicht: 470 g
KIT Scientific Publishing (2018)
Karlsruher Institut für Technologie (KIT Scientific Publishing c/o KIT-Bibliothek
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76131 Karlsruhe, Baden
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