
- Lindenmann, Nicole
Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
- Dissertationsschrift
- Kartoniert,
- KIT Scientific Publishing
- (2018)
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To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.
To create photonic multi-chip modules, integrated photonic chips n ...
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DETAILS
- Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
- Dissertationsschrift
- Lindenmann, Nicole
- Kartoniert, 256 S.
- graph. Darst.
- Sprache: Englisch
- 21 cm
- ISBN-13: 978-3-7315-0746-8
- Titelnr.: 68363781
- Gewicht: 470 g
- KIT Scientific Publishing (2018)
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KIT Scientific Publishing
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76131 - DE Karlsruhe
E-Mail: info@ksp.kit.edu
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