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This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

This book introduces high power semiconductor laser packaging design, examining new technologies and current applications. It details challenges as well as various packaging and testing techniques.


Introduction of High Power Semiconducto ...

DETAILS

  • Packaging of High Power Semiconductor Lasers
  • Liu, Hui, Liu, Xingsheng, Xiong, Lingling
  • Gebunden, xv, 402 S.
  • XV, 402 p. 497 illus., 386 illus. in color.
  • Sprache: Englisch
  • 235 mm
  • ISBN-13: 978-1-4614-9262-7
  • Titelnr.: 41999333
  • Gewicht: 813 g
  • Springer, Berlin (2014)
  • Herstelleradresse

    Springer Heidelberg

    Tiergartenstr. 17|69121|Heidelberg|DE

    E-Mail: buchhandel-buch@springer.com

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