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Lindenmann, NicolePhotonic Wire Bonding as a Novel Technology for Photonic Chip InterfacesDissertationsschrift
Kartoniert, KIT Scientific Publishing (2018)
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To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.

To create photonic multi-chip modules, integrated photonic chips ...

Seitenanzahl
256 S.
Sprache
Englisch
Verlag
KIT Scientific Publishing (2018)
Gewicht
470 g
ISBN-13
978-3-7315-0746-8
Titelnr.
68363781
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