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Xu, YilinHybrid photonic assemblies based on 3D-printed coupling structures
Kartoniert, KIT Scientific Publishing (2023)
49,00 €
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Buch
49,00 €

Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML).

Seitenanzahl
292 S.
Sprache
Englisch
Verlag
KIT Scientific Publishing (2023)
Gewicht
620 g
ISBN-13
978-3-7315-1273-8
Titelnr.
96465338
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